topicmaker Veteran


Joined: 28 Feb 2006 Posts: 25809
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Posted: Thu Mar 22, 2007 1:54 pm Post subject: IBM Unveils Super Conductive Thermal Paste |
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At the IEEE Semi-Therm Conference 2007,
IBM
researchers unveiled details of a new technique to significantly increase
capabilities to cool computer chips. The technique overcomes a barrier in chip
cooling by improving the application of the 'glue' that binds chips to their
cooling systems. The new technology could all...read more |
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