At the IEEE Semi-Therm Conference 2007, IBM researchers unveiled details of a new technique to significantly increase capabilities to cool computer chips. The technique overcomes a barrier in chip cooling by improving the application of the 'glue' that binds chips to their cooling systems. The new technology could allow faster computer chips to be cooled more efficiently.

The results obtained are impressive: The paste thickness was reduced by a factor of 3, and the pressure needed to squeeze the paste to the same bondline thickness was reduced to a similar extent. These lower assembly pressures ensure that the delicate components and interconnects below the chip are not damaged as the chip package is created. The channels also allow pastes with higher fill factors and higher bulk thermal conductivity to be squeezed into thinner gaps, thereby reducing the thermal resistance of the paste interface considerably by more than a factor of 3. The new technology allows air-cooling systems to remove more heat and helps to improve the overall energy efficiency of computers.