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IBM fills 'airgap' to create faster chips

 
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PostPosted: Fri May 04, 2007 6:29 pm    Post subject: IBM fills 'airgap' to create faster chips Reply with quote
IBM
Corp. scientists have developed a new process technology that they say will
allow processors to run significantly faster or draw less power. According to EE
Times, the technology places vacuum spaces between copper wires in silicon
chips, thereby increasing insulation:

The technique creates a vacuum between copper...read more
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