According to a Taiwanese Economic News (TEN) report, MS has TSMC producing a 65nm version of the Xbox 360's graphics chip. The part, along with the 'Xenon' CPU - already fabbed by IBM at 65nm - will be stamped onto the motherboard by Nanya. TSMC is also making the ancillary chippery, it's said. The result will be 'Jasper', the forecast next version of the Xbox 360's core components. The original 360 has a 90nm GPU and a 90nm CPU. Last year, console based on the 'Falcon' platform incorporated the 65nm CPU. With the debut of Jasper and its 65nm GPU, the over-heating problems - manifested most clearly in the infamous Red Ring of Death - that have plagued no small number of Xbox 360 owners will evaporate. So Microsoft undoubtedly hopes, having had to replace many a console that has RRoD-ed. Even today, numerous Register Hardware readers have posted comments stating they have still had to send back malfunctioning consoles for replacement.

I wonder if this will coincide with a revamp of the size?