According to a
Taiwanese Economic News (TEN) report, MS has TSMC producing a
65nm version of the Xbox 360's graphics chip. The part, along with the
'Xenon' CPU - already fabbed by IBM at 65nm - will be stamped onto the
motherboard by Nanya. TSMC is also making the ancillary chippery, it's said. The
result will be 'Jasper', the forecast next version of the Xbox 360's core
components. The original 360 has a 90nm GPU and a 90nm CPU. Last year, console
based on the 'Falcon' platform incorporated the 65nm CPU. With the debut of
Jasper and its 65nm GPU, the over-heating problems - manifested most clearly in
the infamous Red Ring of Death - that have plagued no small number of Xbox 360
owners will evaporate. So Microsoft undoubtedly hopes, having had to replace
many a console that has RRoD-ed. Even today, numerous Register Hardware readers
have posted comments stating they have still had to send back malfunctioning
consoles for replacement.
I wonder if this will coincide with a revamp of the size?
