Researchers from Intel and the University of California at Santa Barbara
(UCSB) have
unveiled a new hybrid silicon laser technology that will allow for faster
communications inside a computer. The researchers succeeded in mixing
light-emitting indium phosphide inside a silicon chip through the use of an
oxide layer that functions as a 'glass glue'. The indium phosphide is required
to power the laser, making a chip's optical component. The new technology
enables manufacturing using regular silicon production technologies, making for
an inexpensive production process.
So-called photonic chips mark a step forward in the development of
semiconductors by allowing them to use optical technology to communicate with
other chips and components inside a computer. Replacing current electrical
communications using copper wires, photonics offer increased bandwidth to power
high speed chips of the future, UCSB professor John Bowers explained in a
conference call.